The application of molybdenum foil in the semiconductor industry
With the rapid development of semiconductor technology, the integration density and power density of chips continue to increase, and the heat dissipation issue has become a key factor restricting the performance and reliability of electronic devices. Traditional heat dissipation materials such as copper and aluminum are gradually approaching their performance limits, while molybdenum foil, with its outstanding properties, shows great potential: its thermal conductivity is 138 W/(m·K), slightly lower than that of copper but much higher than that of most alloys; its coefficient of thermal expansion (4.8×10-6/K) is close to that of silicon (3×10-6/K), which can reduce interface failure caused by thermal stress; its melting point is as high as 2623°C, with excellent high-temperature stability, and it also has good mechanical strength and corrosion resistance, making it an ideal heat dissipation material for high-power density semiconductor devices.
In practical applications, molybdenum foil has significant advantages in the field of semiconductor heat dissipation: as a heat diffusion layer in power device packaging, it can more evenly distribute hot spot temperatures and prevent local overheating; in the field of high-power LEDs, through the efficient heat conduction of molybdenum foil substrates, junction temperatures can be significantly reduced and lifespans extended; especially in third-generation semiconductor devices, due to higher operating temperatures, its high-temperature stability advantage is even more prominent. Experiments show that power modules using molybdenum foil heat sinks can reduce thermal resistance by 15-20%.
Despite its obvious advantages, the application of molybdenum strip still faces challenges: high cost, which can be balanced with performance and cost by developing molybdenum-copper and molybdenum-silver composite materials; poor welding performance, which can be improved by surface nickel plating or active brazing to enhance connection reliability; and high processing difficulty. The new process of powder metallurgy and rolling can be used to prepare 50μm thin and uniform molybdenum strip, and the micro-nano structure on the surface (such as laser micro-grooves) can increase the heat dissipation efficiency by more than 30%. In the future, with the growth of demand in fields such as 5G and new energy vehicles, the market prospects of molybdenum foil are broad. Material compositing (such as graphene-reinforced molybdenum foil) and the integration of structure and function will become the development direction. Intelligent manufacturing will also promote its precision and customized production. It can be foreseen that with technological progress, molybdenum foil will provide key support for semiconductor heat dissipation and help electronic devices achieve high performance and miniaturization.
Mosten Alloy can produce molybdenum sheet, molybdenum block, molybdenum foil, molybdenum rod, molybdenum wire, molybdenum processing workpiece according to customer demand.
