The application fields of molybdenum discs as sputtering targets
Molybdenum discs are widely used as sputtering targets in crop vapor deposition (PVD) processes due to their high purity (≥99.95%), high melting point (2620°C), excellent electrical and thermal conductivity, and good sputtering film-forming properties. In the field of semiconductor manufacturing, molybdenum targets are used to deposit metallized layers, such as barrier layers/adhesive layers, to prevent the diffusion reaction between copper or aluminum wires and silicon substrates, thereby enhancing the reliability of devices. Meanwhile, molybdenum is also used in interconnection wires, when combined with copper to improve electrical conductivity and thermal stability. In the flat panel display industry, molybdenum films are used as the gate or source leakage electrode of TFT-LCD arrays due to their low resistivity and good etching characteristics. In OLeds, molybdenum targets are used for sputtering to form an anode layer with high reflectivity, enhancing the luminous efficiency. In addition, molybdenum targets are also widely used in photovoltaic cells (such as the back electrode of CIGS thin-film solar cells and the charge transport layer conductive substrate of perovskite cells) as well as optical and decorative coatings (such as anti-reflection films, filters and wear-resistant decorative coatings of infrared optical devices).
Technical advantages and challenges
Molybdenum targets have significant technical advantages in the sputtering film formation process, including high sputtering rate, dense and uniform film layer, and matching thermal expansion coefficients with silicon and glass substrates, thereby reducing stress cracking. However, molybdenum targets also face some challenges. For instance, molybdenum is prone to oxidation in the air, so the oxygen content (usually <10 ppm) needs to be strictly controlled during the sputtering process. In addition, the preparation of large-sized target materials (such as G8 and above) is rather difficult and costly, which to some extent limits their large-scale application.
Future development trends and conclusions
With the rapid development of microelectronics technology, the high purification of molybdenum targets (such as 99.999% grade) will become a future development focus to meet the high-end demands of processes below 5nm. Meanwhile, the research and development of composite target materials (such as Mo-Ti and Mo-Ni alloys) will further expand their functional application scope. In addition, the improvement of waste target recycling technology will also help reduce the cost of semiconductor production and promote the sustainable development of molybdenum targets. Overall, molybdenum targets hold an irreplaceable position in the high-end coating field, and their precision and green manufacturing will become the core direction of future development.
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