Tungsten and molybdenum target market or welcome good!
The recent passage of the US $190 billion Innovation and Competition Act will enable US $54 billion of investment in the semiconductor industry, leading to the development of chips with higher performance and more large-scale production. As one of the important components of the chip material, tungsten and molybdenum target material market or welcome good!
Chip is an integrated circuit after the design process of a number of components. Target material is an indispensable raw material for integrated circuit manufacturing. Which makes use of the ion, ion source through accelerating gathered in the high vacuum, and the formation of a high speed can ion beam, the bombardment of solid surface, ions and solid surface atomic momentum exchange, from solid surface atomic solid and deposition in the basal surface, bombarded solid is sputtering deposition film of raw materials, known as the sputtering target materials.
The components that need to use sputtering coating technology in integrated circuits are dielectric layer, conductor layer, protective layer, barrier layer and diffusion layer. At present, the target material with the coating is mainly tungsten target, tungsten titanium target, molybdenum target, titanium target, etc., their purity is generally in 5N (99.999%) above.
Tungsten target material is a kind of product with tungsten powder as the main raw material. It not only has higher purity and density, but also has lower oxygen content, smaller average transparent texture diameter, larger deflection strength, uniform structure and composition, so as to make the quality of the coating finished product is higher. In addition, the cost of tungsten target made by powder metallurgy is more reasonable than that of titanium and other targets.
Molybdenum target material, also known as molybdenum sputtering target material, physical and chemical properties and raw materials (pure molybdenum or molybdenum alloy) have little difference, with high melting point, high conductivity, low specific impedance, good corrosion resistance and environmental protection and health characteristics, so it is also a kind of raw materials for coating.
So, which kind of sputtering target material should be selected in the production process of integrated circuit? The technology and purity requirements of semiconductor target are much higher than those of planar display, solar cell and other application fields, so it is more suitable to select tungsten target, molybdenum target and so on.
