Study on the control of black particles on the surface of tungsten crucible plating film
Electron beam evaporation of gold plating film with tungsten crucible is one of the common techniques for preparing electrodes by microelectronic technology. However, when tungsten crucible is used to evaporate gold, tiny black particles will appear on the surface of gold film, which has a serious impact on the performance of gold electrode or lead at micro/nano size. It is found that the number of black particles vaporized by tungsten crucible changes obviously when the evaporation power and other conditions are adjusted, and the number of black particles decreases first and then increases with the increase of the power. Using the principle of "coffee ring effect", the evaporation power of electron beam was firstly increased and then decreased, which not only controlled the evaporation speed of tungsten crucible, but also successfully reduced the black particles on the surface of gold film, providing reference for teaching experiment, tungsten crucible vacuum coating process and integrated circuit production.
