Molybdenum sputtering targets for semiconductors
Today, sputtering targets are used in a wide range of applications, from the semiconductor industry to thin film deposition of various materials used in the processing of integrated circuits, to energy-efficient glass panes in buildings, the familiar gold hard coatings made of titanium nitride, and wear-resistant coatings for tools and consumer products. Metal deposition during CD and DVD production. All materials can be obtained in the form of sputtering targets.
Sputtering is a well-established technique for depositing thin films of a variety of materials onto substrates of various shapes and sizes. The process is repeatable and can be scaled from small projects to production involving medium to large substrate areas. The sputtering gas is usually an inert gas such as argon. In order to transfer momentum effectively, the mass of the incident particle must match that of the target material.
In order to obtain the desired properties in the films deposited by sputtering, the manufacturing materials and processes used to fabricate the sputtering targets are critical. In addition to pure metal targets such as tungsten, molybdenum, niobium, titanium, silicon and silicon, there are alloy targets such as tungsten, molybdenum, titanium, silicon and tantalum, compounds such as oxides or nitrides. The process of determining the material is as important as the operating parameters of the deposition that the engineers and scientists have perfected in the coating process.
Compared with other deposition methods, sputtering film has better adhesion on the substrate, and materials with high melting point, such as molybdenum and tungsten, are easy to sputter. Sputtering can be carried out from top to bottom, while evaporation can only be carried out from bottom to top.
Sputtering targets are usually round or rectangular, but other shapes can also be made, including square and triangular designs. A substrate is an object to be coated, which may include semiconductor wafers, solar cells, optical components, or many other possibilities. The thickness of the coating is usually in the range of angstroms to microns. The film can be a single material or a variety of materials with a multi-layer structure.
As a refractory metal with a wide range of uses, molybdenum has excellent mechanical properties at high temperatures, low expansion and high thermal conductivity and high electrical conductivity. As the sputtering target material, there are many combinations, such as pure molybdenum target, molybdenum titanium target, molybdenum tantalum target, molybdenum alloy target (such as TZM plate). The molybdenum sputtering target material has the characteristics of high purity, high density, fine and uniform grain, etc., so that high sputtering efficiency, uniform film thickness and smooth etching surface are obtained in sputtering.
