Application, preparation and development of molybdenum sputtering targets
Sputtering, as an advanced thin film preparation technology, has two characteristics: high speed "and" low temperature ". It uses the ions produced by the ion source to accelerate the aggregation of high-speed ion current in vacuum and bombard the solid surface. The kinetic energy exchange occurs between the ions and the atoms on the solid surface, so that the atoms on the solid surface leave the target and deposit on the surface of the substrate, thus forming nano or micron) films. The bombarded solid is the raw material of thin film deposited by sputtering method, which is called sputtering target.
Molybdenum sputtering target can form thin films on various substrates. This sputtering film is widely used in electronic components and electronic products, such as tft-ldd (thin film transition liquid crystal displays), Thin film semiconductor tube liquid crystal display), plasma display panel, inorganic light emitting diode display, field emission display, thin film solar cell sensor, semiconductor device and field-effect transistor gate with tunable work function CMOS complementary metal oxide semiconductor, etc. In this paper, the characteristics of molybdenum sputtering target are summarized and discussed from its application, market, preparation technology and development trend.
Characteristics and application of molybdenum sputtering target
In the electronic industry, molybdenum sputtering target is mainly used as the electrode and wiring material of flat panel display, thin film solar cell and semiconductor barrier material. These are based on molybdenum's high melting point, high conductivity, low specific impedance, good corrosion resistance and good environmental performance.
In the past, the wiring material of flat panel display was mainly chromium, but with the large-scale and high-precision of flat panel display, the material with smaller specific impedance is more and more needed. In addition, environmental protection must be considered. However, molybdenum has the advantages of only 1 / 2 of the specific impedance and membrane stress of chromium, and there is no environmental pollution problem. In addition, molybdenum used in LCD components can greatly improve the performance of LCD in terms of brightness, contrast, color and life. In the flat panel display industry, one of the main market applications of molybdenum sputtering target is TFT-LCD. Market research shows that the next few years will be the peak of LCD development, with an annual growth rate of about 30%. With the development of LCD, the consumption of LCD sputtering target is increasing rapidly, with an annual growth rate of about 20%. In 2006, the global demand for molybdenum sputtering target was about 700 tons, and in 2007 it was about 900 tons. Plus. The electrode layer of CIGS (copper indium gallium selenium) thin film battery is formed by sputtering molybdenum target.
