The application of molybdenum processing products in semiconductor sintering furnaces
In the high-temperature operation environment of semiconductor sintering furnaces, the molybdenum shielding cover is a crucial protective component that ensures the stability of the thermal field and the safety of the furnace body. Its application performance directly determines the accuracy of the sintering process. Based on the requirements of vacuum or reducing atmosphere working environments, this component generally adopts a 3-5 layer composite structure design to form an efficient thermal radiation barrier. To enhance the thermal reflection efficiency, the surface of the shielding cover needs to undergo electrolytic polishing treatment to a mirror-like level, with a roughness controlled at Ra ≤ 0.4 μm, achieving a thermal radiation reflection rate of over 85%. To address the demand for heat conduction prevention, a special corrugated structure design is employed to ensure structural rigidity while effectively extending the heat resistance conduction path. Combined with a 0.1 mm vacuum isolation gap between layers, it can achieve a temperature reduction of over 200°C on the furnace body surface. The recently developed gradient pore-type molybdenum shielding cover uses a laser drilling process to construct a gradually changing pore diameter distribution from 0.5 mm in the inner layer to 2.0 mm in the outer layer, achieving active adaptation and precise control of the thermal field intensity, providing customized thermal environment support for complex sintering processes.
The high-precision molybdenum column and molybdenum strip heating assembly is a key core component for wafer support and temperature supply in semiconductor sintering furnaces. Together, they ensure the stability and consistency of the sintering process. The molybdenum column, as the core component of the wafer support framework, is fabricated using isostatic pressing technology, with diameters ranging from 12 to 25 mm. After forming, its density can reach 10.2 g/cm³. Even at a temperature of 1600°C, the single column's compressive strength can still remain above 280 MPa. To reduce heat conduction loss, the top of the molybdenum column adopts a hemispherical structure design, forming a point contact with the molybdenum tray, which can reduce heat conduction loss by 40%. At the same time, a modular array layout is adopted, allowing for flexible adjustment of spacing according to different specifications of 4-12-inch wafers, with a height tolerance strictly controlled within ±0.05 mm, ensuring the flatness of the wafer loading plane meets the requirements of precision processing. The molybdenum strip heating assembly is made from special rolled molybdenum strips with a thickness of 0.8-2.0 mm, precisely bent into a multi-turn coil structure with double-sided polishing treatment (roughness Ra 0.2 μm). This can effectively reduce the deposition of volatile substances in the high-temperature environment. The electrodes adopt a tapered design and are fixed by liquid nitrogen-cooled copper electrodes, with the contact resistance stably controlled below 0.5 mΩ, ensuring the stability of current transmission. The new corrugated structure molybdenum strip heater has an effective radiation area that is 35% larger than the traditional structure under the same power input condition. Combined with an intelligent power distribution algorithm, it can achieve precise control of the temperature uniformity within the furnace chamber of ±0.8°C, providing a constant high-temperature environment for wafer sintering.
Mo processing parts for atmosphere control and nuclear radiation shielding are crucial for the smooth implementation of semiconductor sintering processes under special conditions. Their performance directly determines the process adaptability and operational safety. The porous Mo gas distribution plate, as the core component of atmosphere regulation, has a thickness of 8-15mm and a surface with a precise micro-hole array of 0.3-0.8mm. The opening rate can be flexibly adjusted within the range of 30-50% according to process requirements. Through computational fluid dynamics simulation optimization of the guiding surface structure, the velocity distribution difference of the process gas in the furnace is controlled within ±5%, ensuring uniform and consistent atmosphere environment in all areas of the wafer. For corrosive atmosphere conditions containing fluorine, a nozzle assembly made of Mo-W alloy material is used, which is seamlessly connected through electron beam welding technology and has excellent corrosion resistance and long-term working stability. Some high-end equipment is equipped with a rotating Mo gas distributor, driven by a servo motor to achieve precise speed control, and can dynamically adjust the atmosphere supply mode according to the sintering process curve, adapting to complex process requirements. In the field of nuclear radiation shielding, W-Mo alloys with a tungsten content of 10-15% are used to prepare shielding components. The neutron absorption cross-section is more than three times higher than that of traditional pure Mo, effectively blocking nuclear radiation interference. The Mo V-shaped blocks used for positioning are manufactured from single-crystal Mo materials, with the (110) crystal plane parallelism error controlled within 0.01°, providing a high-precision mechanical positioning reference for the wafer, ensuring the stability of the wafer's position during the sintering process.
Sealing and connection-type molybdenum components are the core supports that maintain the vacuum environment and structural integrity of semiconductor sintering furnaces. Their sealing performance and connection reliability directly determine the overall operational stability of the furnace body. The corrugated tube-type molybdenum sealing ring is processed using a hydraulic molding process. It not only achieves the vacuum sealing function but also effectively compensates for 3-5mm of thermal expansion displacement, avoiding sealing failure caused by thermal expansion and contraction under high-temperature conditions. The molybdenum-ceramic composite electrode, as the key interface for transmitting electrical signals and thermal energy, adopts a gradient material design concept. Through the hot isostatic pressing diffusion welding process, it realizes stress-free connection between alumina ceramic and molybdenum metal, ensuring the insulation performance of the ceramic material and the strong bonding between the metal and the ceramic, and avoiding joint cracking due to differences in thermal expansion coefficients under high temperatures. The quick-connect molybdenum flange adopts a conical surface sealing structure. Its surface is plated with a 0.1μm-thick iridium layer to enhance the wear resistance and corrosion resistance of the sealing surface. Even after 100 repeated disassembly and assembly uses, the leakage rate can still be stably maintained below 1×10⁻⁹Pa·m³/s, providing a solid guarantee for the long-term stability of the vacuum environment inside the furnace.
The excellent high-temperature performance and precise dimensional accuracy of molybdenum processing parts are attributed to a complete set of strict manufacturing process systems and comprehensive inspection process control. In the raw material stage, electron beam suspension melting technology is adopted, which can increase the purity of molybdenum to 99.97%, effectively eliminating the influence of impurity elements on performance; in the forming stage, isostatic pressing molding technology is used to ensure uniform density of the billet, and then it undergoes a 1600℃ high-temperature sintering treatment, obtaining fine-grained and uniform microstructure, laying the foundation for the excellent performance of the components. For complex structures and curved surface processing, five-axis slow wire cutting technology is relied upon， with processing accuracy reaching ±0.005mm， meeting the requirements of precise assembly; component connections adopt vacuum brazing technology, using Ni-Mn-based solder, making the joint strength reach over 90% of the base material strength, ensuring the structural stability and high-temperature reliability of the connection part. To ensure product quality, each batch of molybdenum processing parts must pass more than 30 strict inspections, including helium mass spectrometry leak detection (sensitivity of 1×10⁻¹²Pa·m³/s), X-ray residual stress analysis (resolution of 0.5μm), and 1800℃ high-temperature deformation test for 24 hours, comprehensively verifying the sealing performance， mechanical properties and high-temperature stability of the components， ensuring that the products meet the precise application requirements of semiconductor sintering furnaces.
With the rapid development of semiconductor manufacturing technology towards higher integration and wide bandgap directions, molybdenum processing components are accelerating their evolution towards intelligence, integration, high temperature resistance, and low pollution. In terms of intelligent upgrades, molybdenum-based components with embedded optical fiber sensors have achieved real-time monitoring of stress distribution under high-temperature conditions. Intelligent molybdenum heaters can automatically compensate for thermal field deviations based on multi-point temperature measurement data, improving process adaptability and stability. In terms of structural optimization, the application of 3D printing topology optimization technology enables molybdenum structural components to achieve a 35% weight reduction while enhancing stiffness. Nano-coating treatment increases the surface hardness of the components to HV1200, enhancing wear resistance and anti-pollution capabilities. Facing the demand for high-temperature sintering processes by wide bandgap semiconductors, molybdenum processing components are breaking through the existing temperature limits and advancing towards higher temperature ranges of 2200°C. At the same time, through process optimization, the content of high-temperature volatile substances is reduced to meet the requirements of low-pollution manufacturing. As an indispensable "high-temperature framework" in modern semiconductor manufacturing processes, the continuous technological innovation of molybdenum processing components will provide core material support for the upgrading and iteration of semiconductor manufacturing equipment, and help the semiconductor industry achieve high-quality development.
Molybdenum foils are demanded in various parts of the world, such as: USA, Canada, Chile, Brazil, Argentina, Colombia, Germany, France, United Kingdom, Italy, Sweden, Austria, Netherlands, Belgium, Switzerland, Spain, Czech Republic, Poland.
As professional Chinese manufacturer, Mosten Alloy can produce and supply molybdenum electrode, molybdenum strip, molybdenum sheet, molybdenum pellet, molybdenum block, molybdenum tube, molybdenum rod, molybdenum wire, molybdenum processing workpiece according to customer demand.
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