The precise application of molybdenum processing components in semiconductor sintering furnaces
The molybdenum shielding cove is the core protective component in the high-temperature zone of the semiconductor sintering furnace. In a vacuum or reducing atmosphere environment, a multi-layer molybdenum shielding cover (usually 3-5 layers) forms a precise thermal radiation barrier. Its surface is electrochemically polished to a mirror-like state (Ra ≤ 0.4 μm), which can increase the thermal radiation reflectivity to over 85%. The specially designed corrugated structure molybdenum shielding cover maintains rigidity while increasing the thermal resistance path. Combined with a 0.1 mm true air gap between layers, it reduces the surface temperature of the furnace body by more than 200°C. The newly developed gradient-pore molybdenum shielding cover uses laser drilling technology to form a gradually increasing pore diameter distribution from the inner layer to the outer layer (0.5 mm - 2.0 mm), achieving active control of the thermal field.
High-precision molybdenum columns play a crucial role as the load-bearing framework for wafers in the sintering furnace. The molybdenum columns with diameters ranging from 12 to 25 mm are formed by isostatic pressing and have a density of up to 10.2 g/cm3. The compressive strength of a single column remains above 280 MPa even at 1600°C. The top of these molybdenum columns adopts a hemispherical design, forming a point contact with the molybdenum tray, reducing heat conduction loss by 40%. The modular molybdenum column array system allows for flexible configuration of spacing according to wafer sizes (4-12 inches), with a height tolerance controlled within ±0.05 mm to ensure loading flatness. Some advanced systems use molybdenum-lanthanum oxide composite columns, which improve the high-temperature creep resistance by three times and extend the service life to over 5000 furnace cycles.
The specially rolled molybdenum strip (thickness 0.8 - 2.0mm) is precisely bent to form multi-turn heating coils. Its surface roughness is polished on both sides to reach Ra0.2μm, reducing the deposition of volatile substances at high temperatures. The molybdenum electrode adopts a tapered combination structure and is held by copper electrodes cooled by liquid nitrogen, with the contact resistance stabilized at below 0.5mΩ. The newly designed corrugated molybdenum strip heater increases the effective radiation area by 35% at the same power, and in combination with the intelligent power distribution algorithm, can achieve ±0.8℃ temperature uniformity within the furnace. These heating components are usually combined with alumina insulating sleeves to form a stable and reliable heating system.
The porous molybdenum gas distribution plate is a key component for atmosphere control. The plate, with a thickness of 8-15mm, features a micro-pore array with a diameter of 0.3-0.8mm, and the opening rate can be adjusted from 30% to 50%. The flow guiding surface designed through computational fluid dynamics optimization ensures that the velocity difference of the process gas within the furnace is controlled within ±5%. The molybdenum alloy (Mo-W) nozzle assembly used in special conditions is seamlessly connected through electron beam welding and can operate for a long time in a fluorine-containing atmosphere. The rotating molybdenum gas distributor included in some system configurations is driven by a servo motor to achieve dynamic atmosphere regulation, meeting the requirements of complex process curves.
The nuclear radiation shielding molybdenum components play a crucial role in the sintering process of power devices. By adding 10-15% tungsten to the molybdenum matrix to form a W-Mo alloy, the neutron absorption cross-section is increased by more than three times that of traditional molybdenum. The internal of the microchannel-cooled molybdenum substrate is integrated with spiral flow channels of a width of 0.5mm. After introducing helium gas, the cooling rate can reach 80℃/min. The molybdenum V-type blocks used for positioning are manufactured from single-crystal molybdenum materials， with a parallelism error of the (110) crystal plane less than 0.01°， providing precise mechanical positioning reference for the wafers. The application of these special components has significantly expanded the sintering process window.
The corrugated tube type molybdenum sealing ring is manufactured through a hydraulic molding process and can compensate for 3-5mm of thermal expansion displacement while maintaining a vacuum seal. The molybdenum-ceramic composite electrode is introduced with a gradient material design, and the oxide aluminum ceramic and molybdenum metal are connected stresslessly through hot isostatic pressing diffusion welding. The quick-connect molybdenum flange adopts a conical surface sealing structure and is coated with a 0.1μm thick iridium layer. After 100 repetitions, the leakage rate remains below 1×10⁻⁹Pa·m³/s. These connection components constitute the guarantee system for the reliable operation of the sintering furnace.
The performance of molybdenum processing parts depends on the precise manufacturing process. Electron beam suspension melting ensures that the purity of the raw materials reaches 99.97%, and after isostatic pressing, it undergoes high-temperature sintering at 1600°C to obtain fine-grained structure. Five-axis slow wire cutting realizes the processing of complex curved surfaces with an accuracy of ±0.005mm. Vacuum brazing uses Ni-Mn-based solder, and the joint strength is over 90% of the base material. Each batch of components must pass more than 30 tests, including helium mass spectrometry leak detection (sensitivity 1×10⁻¹²Pa·m³/s), X-ray residual stress analysis (resolution 0.5μm)， and high-temperature deformation test (1800°C for 24 hours).
The future of molybdenum processing components is moving towards intelligence and integration. Embedded optical fiber sensors in molybdenum components can monitor stress distribution in real time, and intelligent molybdenum heaters automatically compensate for thermal field deviations through multi-point temperature measurement. 3D-printed topology-optimized molybdenum structures reduce weight by 35% while improving stiffness, and molybdenum parts with nano-coatings can have a surface hardness of up to HV1200. With the increasing demand for wide-bandgap semiconductors, molybdenum processing components are continuously evolving towards higher temperature ranges of 2200°C and lower pollution levels, providing key material support for the upgrade of semiconductor manufacturing equipment.
The molybdenum processing components, with their precise geometric design and outstanding high-temperature performance, have created a stable and reliable thermal environment in the semiconductor sintering furnaces, becoming an indispensable "high-temperature framework" in modern semiconductor manufacturing processes.
Molybdenum foils are demanded in various parts of the world, such as: USA, Canada, Chile, Brazil, Argentina, Colombia, Germany, France, United Kingdom, Italy, Sweden, Austria, Netherlands, Belgium, Switzerland, Spain, Czech Republic, Poland.
As professional Chinese manufacturer, Mosten Alloy can produce and supply molybdenum electrode, molybdenum strip, molybdenum sheet, molybdenum pellet, molybdenum block, molybdenum tube, molybdenum rod, molybdenum wire, molybdenum processing workpiece according to customer demand.
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