Tungsten molybdenum target
Chip is a component produced by integrated circuit after many design procedures. Target material is an essential raw material for IC manufacturing. It uses the ions produced by the ion source to gather at an accelerated rate in a high vacuum to form an ion beam with high velocity energy and bombard the solid surface. Kinetic energy exchange occurs between the ions and the atoms on the solid surface, so that the atoms on the solid surface leave the solid and deposit on the base surface. The bombarded solid is the raw material for deposition of the thin film by sputtering method, which is called the sputtering target material.
The components that need to use sputtering coating process in integrated circuit include medium layer, conductor layer, protective layer, barrier layer and diffusion layer. At present, the main coating target materials are tungsten target, tungsten titanium target, molybdenum target, titanium target, etc., their purity is generally 5N (99.999%) above.
Tungsten target material is a kind of product with tungsten powder as the main raw material. It not only has higher purity and density, but also has lower oxygen content, smaller average transparent grain diameter, larger deflection force, microstructure and uniform composition, etc., which can make the coating product of higher quality. In addition, the cost of a tungsten target made by powder metallurgy is more reasonable than that of other targets such as titanium.
Molybdenum target material, also known as molybdenum sputtering target material, physical and chemical properties and raw materials (pure molybdenum or molybdenum alloy) little different, with high melting point, high conductivity, low specific impedance, good corrosion resistance and environmental health characteristics, so it is also a coating of a raw material.
So, which kind of sputtering target should be selected in the production process of integrated circuits? Semiconductor target technology and purity requirements are much higher than flat display, solar cells and other application fields, so it is more suitable to choose tungsten target, molybdenum target.
In addition to the U.S. expanding its semiconductor market, other countries are also grappling with a chip supply crisis. In terms of the scale of the artificial market, the global artificial intelligence market will reach 6.4 trillion US dollars in 2025, and the AI chip market will reach 70 billion US dollars. In addition, China plans to achieve a chip self-supply rate of 40 percent by 2022, and increase it to 70 percent by 2025, which will reduce the cost of imported chips by 1.5 trillion yuan.
