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The high purity tungsten target material for chip manufacturing has been made in China

  • Mosten
  • 22 Jan

In semiconductor integrated circuits, thin film science is a very important research field in developing and manufacturing semiconductor devices. The target material is the key material in the surface coating technology. The performance of the target material directly affects the performance of the film, and then affects the performance, cost, benefit and comprehensive competitiveness of the whole chip manufacturing.

A thin transparent metal conductive film is coated on each functional layer of semiconductor chip with precision instruments and equipment. The thickness of the film varies according to the functional requirements, generally between 30um and 200um, less than one-fifth of the hair diameter, in order to achieve the physical and chemical properties of semiconductor metal. The industry calls this layer thin film. In the metallization process of semiconductor chip manufacturing, tungsten oxide film is a widely studied functional material, which is mainly used as diffusion barrier layer, bonding layer and large scale integrated circuit memory electrode.

Sputtering is one of the main techniques for preparing thin film materials. It bombards the target with high-speed moving ions, and the atoms emitted accumulate on the surface of the substrate to form a coating. The bombarded solid is the raw material for sputtering deposition of thin films, which is called sputtering target. The key to coating thin films is the device called "target".

Tungsten target is an important substrate for the functional transition of tungsten oxide thin films in semiconductor devices. Due to the high melting point of tungsten, tungsten targets are mainly prepared by powder metallurgy. For the tungsten target materials previously used in the field of chip manufacturing, only a few companies in the world have mastered the relevant manufacturing technology, such as the United States and Japan. However, just a few days ago, a Chinese enterprise made a breakthrough in the field of chip tungsten targets, which not only ended the history that metal targets had to rely on imports, but even entered the world's first echelon in this field.

Tungsten target in the semiconductor field, semiconductor integrated circuit has a high requirement for the purity of the target, which is generally required to be more than 99.999%. At the same time, the density of the target also has an important influence on the coating process and the performance of the film. The density of the target not only affects the deposition rate, the density of the sputtered film particles and the discharge phenomenon, but also affects the electrical and optical properties of the sputtered film. The denser the target material is, the lower the density of the sputtered film particles is, the weaker the discharge phenomenon is, and the better the performance of the film is.

The general process of manufacturing tungsten target is to mix the powder according to the proportion, and then form it by high temperature sintering. Seemingly simple process, its manufacturing technology details are as complicated as side branches, various parameter control requirements are very high, the difference is a thousand miles. In recent years, with the attention of our country, our target material manufacturing level in the electronic field has made great progress, with more and more patented technologies. However, only the metal target materials used in the manufacture of large-scale integrated circuit chips are still under control. Because for domestic enterprises, our technology accumulation is still weak, and the accumulation of time and experience is a difficult hurdle. The most difficult problem in manufacturing tungsten target is not density and purity, but how to manufacture large-size target.

Tungsten targets are usually sintered by powder metallurgy at high temperature, but the melting point of tungsten is very high, so the core of manufacturing tungsten targets is sintering technology. Sintering technology determines the quality of products, if not, it is easy to cause the problem of density instability. Moreover, with the rapid development of semiconductor technology, the degree of integration is getting higher and higher. The number of integrated devices per unit area of single crystal silicon wafer is growing exponentially. The mainstream size of silicon wafer has gradually moved from 12 inches (300 mm) to 18 inches (450 mm) or higher. The size requirement of sputtering tungsten target is also increasing. If it can't keep up, the production cost and process of semiconductor manufacturing enterprises will be reduced There is no competitiveness.

Fortunately, with the support of "made in China 2025" policy, more and more people with vision return home to start their own businesses. They not only bring back advanced technical experience, but also create a better R & D atmosphere. With the efforts of the Chinese people, we have finally been able to see the bright future, and the local enterprises have finally broken through the technical difficulties of manufacturing high-purity tungsten targets.