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High purity tungsten target material for chip manufacturing has been made in China

Semiconductor large-scale integrated circuit (chip) is the world's most advanced manufacturing technology. For a long time, China has been lagging behind the developed countries in this field, and by Europe and the United States, the world's most advanced chip technology monopoly, China chip imports of crude oil has spent more than a year, but also worried that foreigners will from time to time to "China science and technology, we can only" be around "helplessly, as the recent events as zte.

In semiconductor integrated circuits, thin film science is a very important research field to develop and manufacture semiconductor devices. Target material is the key material in the surface coating technology. The performance of target material directly affects the performance of thin film, and then affects the performance, cost, benefit and comprehensive competitiveness of the whole chip manufacturing.

With precision instruments and equipment in the semiconductor chip each functional layer on the metal plating a thin layer of transparent conductive film, the thickness of the membrane due to the functional requirements is different, generally between 30 nm to 200 nm, less than a human hair one over five hundred diameter, to achieve the physical and chemical properties of the metal, semiconductor industry call this layer of thin film. In the metallization process of semiconductor chip manufacturing, tungsten oxide thin film is a widely studied functional material, which is mainly used as the diffusion barrier layer of integrated circuit, bonding layer and large integrated circuit memory electrode.

Sputtering is one of the main techniques for preparing thin film materials. It bombards the target material with ions in high speed and generates atoms which are emitted and accumulated on the surface of the substrate to form a coating film. The solid under bombardment is the raw material for deposition of thin films by sputtering method. This raw material is called sputtering target material, and the key to coating thin films is the device called "target material".

Tungsten target is an important substrate for the transition of tungsten oxide thin films in semiconductor devices. Due to the high melting point of tungsten, tungsten targets are mainly prepared by powder metallurgy. Previously, only a few companies in the United States, Japan and other countries have mastered relevant manufacturing technologies for tungsten target materials used in chip manufacturing. But just a few days ago, China central television "brilliant China" reported that a company in ningbo, zhejiang province, China has achieved a breakthrough in the field of tungsten chip target, not only ending the history of metal target must rely on imports, but even entered the world's first echelon in this field.

Tungsten target in the field of semiconductor semiconductor semiconductor integrated circuit has a very high requirement for the purity of the target material, generally requires the purity of the target material to be more than 99.999%.At the same time, the density of the target material also has an important impact on the coating process and film properties. The density of the target material not only affects the deposition rate, the density of sputtering film particles and discharge phenomenon, but also affects the electrical and optical properties of the sputtering film. The denser the target material, the lower the density of sputtering film particles, the weaker the discharge phenomenon, and the better the film performance.

The general process of manufacturing tungsten target material is to mix powder according to the proportion first, and then form by high temperature sintering. Seemingly simple process, its manufacturing technical details are as complex as branch and dislocation, and various parameters control requirements are extremely high. In recent years, with the attention of the state, we have made considerable progress in the target manufacturing level in the field of electronics, more and more patented technology, but only for large-scale integrated circuit chip manufacturing metal target is still subject to control. Because for domestic enterprises, our technology accumulation is still weak, time and experience accumulation is a difficult hurdle. The most difficult problem in manufacturing tungsten target is not the density and purity, but how to manufacture large size target.

Tungsten target is generally made of powder gold treatment method of high temperature sintering, but tungsten melting point is very high, so the core of manufacturing tungsten target is sintering technology. Sintering technology determines the quality of the product, less time than home, it is easy to cause density instability. And with the rapid development of semiconductor technology, the integration degree is higher and higher, monocrystalline silicon chip integrated device number per unit area exponentially, mainstream silicon wafer size is from 12 inches (300 mm), gradually moving towards 18 inches (450 mm) or higher, to the size of the sputtering target material tungsten requirements also more and more big, if can't keep up with, the cost of production and technology of the semiconductor manufacturing enterprises are not competitive.

Fortunately, with the support of the "made in China 2025" policy, more and more people of vision and ambition have returned to China to start businesses. They have not only brought back advanced technical experience, but also created a better research and development atmosphere. Thanks to the efforts of the Chinese people, we finally managed to keep the clouds open and see the moon shining. Local enterprises finally broke through the technical manufacturing difficulties of high-purity tungsten target material and completely broke the monopoly of foreign countries. Since then, we no longer need to look at foreigners' faces on this key device. Finally, the author would like to say that although the gap between us in the semiconductor field is still obvious at present, there is no reason why we cannot catch up with developed countries in semiconductor chip technology as long as hard-working and intelligent Chinese people can be neither arrogant nor impetuous nor ostentatious, quietly and diligently study.