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Mosten Alloy Co., Ltd.

Tungsten sputtering target

  • Mosten
  • 18 Feb

In todayundefineds IT industry rapid development today, chips can be said to be a variety of data analysis brain, is the core! At present, for high purity sputtering targets, the most advanced application field is the manufacture of vlsi chips, in fact semiconductor chips and other fields, it also has a large market share. In addition, with the increasing demand for automotive and other terminal semiconductor chips, the market capacity of semiconductor chips will be further enhanced in the future. Consumers believe that the Chinese automobile chip, will never lack the heart, in the near future, also can not lack the "core" eyeball! Tungsten can be seen vaguely in Chinese on-board chips. More specifically, it is a high purity tungsten sputtering target, that is, a tungsten target with a purity of 99.999% (5N) or higher. So, what are tungsten sputtering targets? Tungsten sputtering target is not only the key material film for electron preparation, but also the target in sputtering process. Tungsten sputtering target can be divided into pure tungsten sputtering target, tungsten alloy sputtering target and tungsten oxide sputtering target according to chemical composition. The production chain of high purity tungsten target mainly includes manufacture of purified metal tungsten, manufacture of high purity tungsten target and sputtering coating process. The manufacture of high purity tungsten target and sputtering coating is an important process in the whole production chain of high purity tungsten target. As sputtering coating is one of the key links in the whole production chain of tungsten sputtering target, it is necessary to understand the sputtering technology. Sputtering technology is one of the main techniques for the preparation of electronic thin films, and is also one of the physical vapor deposition. Sputtering principle: the tungsten target is bombarded with high-pressure accelerating gas ions, and the atoms of the tungsten target spatter out one after another. The deposited tungsten materials on the target substrate in the form of snowflake films at high temperature and high vacuum can make these tungsten atoms form tungsten grains and then pattern and etch through microshadows to form a wire layer. These wires are used to transmit data from semiconductor chips used in cars.